3D C/SiC

Partners jointly propose developing an innovative lightweight composite material comprising a 3D pre-form reinforcement of Pitch carbon fibres and silicon carbide ceramic matrix material, henceforth called 3D C/SiC. It will be uniquely advantageous as it will have high delamination resistance and damage tolerance due to through-thickness direction fibres while being heat conducting, vibration damping, and up to ~30% lighter than conventional materials. A variety of optimised, robust, and precise components can be made near-net shape or machined directly from a block or plate of 3D C/SiC relatively quickly, easily, and cost-effectively for small satellites, drones etc. 3D C/SiC will also benefit as a non-metallic heat conductor for space electronics applications. Shared gains for project constellation include the development of a novel material for the identified market case.